芯(xin)(xin)片(pian)(pian)封(feng)(feng)(feng)裝材(cai)(cai)(cai)料的(de)(de)選(xuan)(xuan)(xuan)(xuan)擇：芯(xin)(xin)片(pian)(pian)封(feng)(feng)(feng)裝材(cai)(cai)(cai)料的(de)(de)選(xuan)(xuan)(xuan)(xuan)擇直接影(ying)響(xiang)封(feng)(feng)(feng)裝性能(neng)與成本。常(chang)見的(de)(de)封(feng)(feng)(feng)裝材(cai)(cai)(cai)料有塑(su)料、陶瓷、金屬(shu)等(deng)。塑(su)料封(feng)(feng)(feng)裝成本低(di)、工(gong)藝簡單，適(shi)用(yong)于多數民用(yong)電(dian)子產品；陶瓷封(feng)(feng)(feng)裝散熱性好、可靠性高(gao)，常(chang)用(yong)于航(hang)(hang)天等(deng)領(ling)域；金屬(shu)封(feng)(feng)(feng)裝則在電(dian)磁屏蔽方面表現(xian)優(you)異。中清航(hang)(hang)科(ke)在材(cai)(cai)(cai)料選(xuan)(xuan)(xuan)(xuan)擇上(shang)擁有豐富經驗，會(hui)(hui)根據客戶產品的(de)(de)應用(yong)場景、性能(neng)需求及(ji)成本預算，為其推薦合適(shi)的(de)(de)封(feng)(feng)(feng)裝材(cai)(cai)(cai)料，并(bing)嚴格把控材(cai)(cai)(cai)料質量，從(cong)源頭確保(bao)封(feng)(feng)(feng)裝產品的(de)(de)可靠性。例如，針對航(hang)(hang)天領(ling)域客戶，中清航(hang)(hang)科(ke)會(hui)(hui)優(you)先(xian)選(xuan)(xuan)(xuan)(xuan)用(yong)高(gao)性能(neng)陶瓷材(cai)(cai)(cai)料，保(bao)障芯(xin)(xin)片(pian)(pian)在極端環(huan)境下穩定(ding)工(gong)作。微(wei)型芯(xin)(xin)片(pian)(pian)封(feng)(feng)(feng)裝難度大(da)，中清航(hang)(hang)科(ke)微(wei)縮技術，實現(xian)小體積(ji)承載強性能(neng)。上(shang)海半(ban)導體激(ji)光芯(xin)(xin)片(pian)(pian)封(feng)(feng)(feng)裝

中(zhong)(zhong)清(qing)(qing)航(hang)(hang)科(ke)在(zai)(zai)芯(xin)片(pian)(pian)封(feng)(feng)(feng)裝(zhuang)(zhuang)(zhuang)領域(yu)的(de)(de)優勢(shi)-定制(zhi)化服務：中(zhong)(zhong)清(qing)(qing)航(hang)(hang)科(ke)深知不同客(ke)(ke)戶(hu)在(zai)(zai)芯(xin)片(pian)(pian)封(feng)(feng)(feng)裝(zhuang)(zhuang)(zhuang)需求上存(cun)在(zai)(zai)差(cha)異，因(yin)此提供(gong)定制(zhi)化的(de)(de)封(feng)(feng)(feng)裝(zhuang)(zhuang)(zhuang)服務。公司專業團隊會(hui)與客(ke)(ke)戶(hu)深入溝通(tong)，充分(fen)了(le)解客(ke)(ke)戶(hu)的(de)(de)應用場景、性能要(yao)求以及(ji)成本預算等，然后為客(ke)(ke)戶(hu)量身(shen)定制(zhi)合適的(de)(de)芯(xin)片(pian)(pian)封(feng)(feng)(feng)裝(zhuang)(zhuang)(zhuang)方案(an)。無論是(shi)標準(zhun)封(feng)(feng)(feng)裝(zhuang)(zhuang)(zhuang)還是(shi)特殊定制(zhi)封(feng)(feng)(feng)裝(zhuang)(zhuang)(zhuang)，中(zhong)(zhong)清(qing)(qing)航(hang)(hang)科(ke)都(dou)能憑借自(zi)身(shen)實力(li)，為客(ke)(ke)戶(hu)打造獨特的(de)(de)封(feng)(feng)(feng)裝(zhuang)(zhuang)(zhuang)產(chan)(chan)品。中(zhong)(zhong)清(qing)(qing)航(hang)(hang)科(ke)在(zai)(zai)芯(xin)片(pian)(pian)封(feng)(feng)(feng)裝(zhuang)(zhuang)(zhuang)領域(yu)的(de)(de)優勢(shi)-質(zhi)(zhi)量管(guan)控：質(zhi)(zhi)量是(shi)中(zhong)(zhong)清(qing)(qing)航(hang)(hang)科(ke)的(de)(de)生命線(xian)。在(zai)(zai)芯(xin)片(pian)(pian)封(feng)(feng)(feng)裝(zhuang)(zhuang)(zhuang)過(guo)(guo)程中(zhong)(zhong)，公司建立了(le)嚴格的(de)(de)質(zhi)(zhi)量管(guan)控體(ti)系，從原(yuan)材料采購到(dao)生產(chan)(chan)過(guo)(guo)程中(zhong)(zhong)的(de)(de)每一(yi)道(dao)工序，再到(dao)產(chan)(chan)品檢測，都(dou)進行了(le)多方位(wei)、多層次的(de)(de)質(zhi)(zhi)量監控。通(tong)過(guo)(guo)先進的(de)(de)檢測設(she)備(bei)和嚴格的(de)(de)檢測標準(zhun)，確保每一(yi)個封(feng)(feng)(feng)裝(zhuang)(zhuang)(zhuang)芯(xin)片(pian)(pian)都(dou)符合高質(zhi)(zhi)量要(yao)求，為客(ke)(ke)戶(hu)提供(gong)可(ke)靠(kao)的(de)(de)產(chan)(chan)品保障(zhang)。上海半導(dao)體(ti)激光芯(xin)片(pian)(pian)封(feng)(feng)(feng)裝(zhuang)(zhuang)(zhuang)毫米(mi)波芯(xin)片(pian)(pian)封(feng)(feng)(feng)裝(zhuang)(zhuang)(zhuang)難，中(zhong)(zhong)清(qing)(qing)航(hang)(hang)科(ke)三(san)維集成技(ji)術(shu)，突破高頻信號(hao)傳輸瓶(ping)頸。

芯片封裝的(de)(de)標(biao)(biao)(biao)準化(hua)與(yu)定制(zhi)化(hua)平衡(heng)(heng)：芯片封裝既(ji)有標(biao)(biao)(biao)準化(hua)的(de)(de)產品以(yi)滿足(zu)通用(yong)需求，也有定制(zhi)化(hua)的(de)(de)服務(wu)以(yi)適(shi)應(ying)特殊場(chang)景(jing)。如何(he)平衡(heng)(heng)標(biao)(biao)(biao)準化(hua)與(yu)定制(zhi)化(hua)，是企業提升競爭力(li)的(de)(de)關鍵。中清航科(ke)擁有豐富(fu)的(de)(de)標(biao)(biao)(biao)準化(hua)封裝產品系列，能快速滿足(zu)客戶(hu)(hu)的(de)(de)通用(yong)需求；同(tong)時，公司(si)具備強大(da)的(de)(de)定制(zhi)化(hua)能力(li)，可根據客戶(hu)(hu)的(de)(de)特殊要求，從封裝結構、材料選擇(ze)到工藝(yi)設計，提供(gong)多方位(wei)的(de)(de)定制(zhi)服務(wu)，實現標(biao)(biao)(biao)準化(hua)與(yu)定制(zhi)化(hua)的(de)(de)靈活平衡(heng)(heng)。想要了解(jie)更多內容可以(yi)關注我司(si)官網，同(tong)時歡(huan)迎(ying)新老客戶(hu)(hu)來電咨詢。

中(zhong)(zhong)(zhong)清航(hang)科超細間(jian)距倒(dao)裝(zhuang)焊工藝突破10μm極(ji)限。采(cai)(cai)用(yong)(yong)激光輔(fu)助自對準(zhun)技術，使30μm微凸點(dian)對位精度(du)(du)達±1μm。在CIS圖像傳感(gan)器封裝(zhuang)中(zhong)(zhong)(zhong)，該技術消除微透鏡偏移(yi)問題，提升低光照(zhao)下15%成像質量。中(zhong)(zhong)(zhong)清航(hang)科開發出(chu)超薄(bo)中(zhong)(zhong)(zhong)心(xin)less基板，厚度(du)(du)100μm。通過半加成法（mSAP）實(shi)現2μm線(xian)寬/間(jian)距，傳輸損耗低于(yu)0.3dB/mm@56GHz。其5G毫米波(bo)AiP天線(xian)封裝(zhuang)方案(an)已通過CTIAOTA認證，輻(fu)射效(xiao)率(lv)達72%。為響(xiang)應(ying)歐(ou)盟RoHS2.0標準(zhun)，中(zhong)(zhong)(zhong)清航(hang)科推出(chu)無鉛高(gao)可靠性(xing)封裝(zhuang)方案(an)。采(cai)(cai)用(yong)(yong)Sn-Bi-Ag合金(jin)凸點(dian)，熔點(dian)138℃且抗跌落性(xing)能(neng)提升3倍。其綠色電(dian)鍍(du)工藝使廢水(shui)重金(jin)屬含(han)量降低99%，獲三星(xing)Eco-Partner認證。穿戴設備芯片需輕薄(bo)，中(zhong)(zhong)(zhong)清航(hang)科柔性(xing)封裝(zhuang)，適(shi)配人(ren)體運(yun)動場(chang)景需求。

常見(jian)芯(xin)(xin)片(pian)(pian)封(feng)(feng)裝(zhuang)(zhuang)(zhuang)類(lei)型(xing)-PQFP：PQFP是塑料方形扁(bian)平封(feng)(feng)裝(zhuang)(zhuang)(zhuang)，常用(yong)于(yu)大(da)規模或超大(da)型(xing)集成電路，引腳數一般在100個(ge)以上(shang)。該封(feng)(feng)裝(zhuang)(zhuang)(zhuang)形式引腳間距小、管腳細，需(xu)(xu)(xu)采用(yong)SMD（表面(mian)安裝(zhuang)(zhuang)(zhuang)設備技(ji)術(shu)）將芯(xin)(xin)片(pian)(pian)與主(zhu)板(ban)焊接。這(zhe)種(zhong)方式使(shi)得芯(xin)(xin)片(pian)(pian)在主(zhu)板(ban)上(shang)無需(xu)(xu)(xu)打(da)孔，通過主(zhu)板(ban)表面(mian)設計(ji)(ji)好(hao)的焊點(dian)即(ji)可完成焊接，且(qie)拆卸需(xu)(xu)(xu)用(yong)工具。PQFP適用(yong)于(yu)高頻使(shi)用(yong)，操作(zuo)方便、可靠性高，芯(xin)(xin)片(pian)(pian)面(mian)積與封(feng)(feng)裝(zhuang)(zhuang)(zhuang)面(mian)積比值(zhi)小。中清航(hang)科的PQFP封(feng)(feng)裝(zhuang)(zhuang)(zhuang)技(ji)術(shu)在行業內頗具優勢，能滿足客戶(hu)對芯(xin)(xin)片(pian)(pian)高頻性能及小型(xing)化的需(xu)(xu)(xu)求，廣泛應用(yong)于(yu)通信(xin)、消費電子等領域。中清航(hang)科聚(ju)焦芯(xin)(xin)片(pian)(pian)封(feng)(feng)裝(zhuang)(zhuang)(zhuang)，用(yong)創新結構設計(ji)(ji)，提升芯(xin)(xin)片(pian)(pian)抗振動沖(chong)擊能力。半導體(ti)封(feng)(feng)裝(zhuang)(zhuang)(zhuang)模具

**芯片求(qiu)穩求(qiu)精(jing)，中清航科封裝方案，滿足高可靠性與生物兼容性。上海(hai)半導體激光(guang)芯片封裝

芯(xin)(xin)片(pian)(pian)封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)的發(fa)(fa)展(zhan)(zhan)歷程：自20世紀(ji)80年代起，芯(xin)(xin)片(pian)(pian)封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)技術歷經多代變革。從(cong)早期(qi)的引腳插入式(shi)封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)，如DIP（雙列(lie)(lie)直插式(shi)封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)），發(fa)(fa)展(zhan)(zhan)到表面貼片(pian)(pian)封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)，像QFP（塑料方形扁平封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)）、PGA（針柵陣列(lie)(lie)封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)）等。而后，BGA（球(qiu)柵陣列(lie)(lie)封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)）、MCP（多芯(xin)(xin)片(pian)(pian)模塊）、SIP（系統級封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)）等先進(jin)封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)形式(shi)不(bu)斷涌現。中(zhong)清航科緊跟芯(xin)(xin)片(pian)(pian)封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)技術發(fa)(fa)展(zhan)(zhan)潮流，不(bu)斷升級自身技術工(gong)藝，在各個發(fa)(fa)展(zhan)(zhan)階段都積累了(le)豐富經驗，能(neng)為客戶提供符合(he)不(bu)同時期(qi)技術標(biao)準和市場需求的封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)服(fu)務。上(shang)海半(ban)導(dao)體激光芯(xin)(xin)片(pian)(pian)封(feng)(feng)(feng)(feng)裝(zhuang)(zhuang)