消(xiao)費(fei)電(dian)子(zi)是 PCB 定(ding)制(zhi)(zhi)的(de)(de)主要應(ying)用(yong)領域(yu)之一(yi)，面(mian)對(dui)智(zhi)能手(shou)機、平板電(dian)腦、可(ke)穿(chuan)戴(dai)設備等產品(pin) “更(geng)輕薄(bo)、更(geng)高(gao)集(ji)成” 的(de)(de)發展趨勢(shi)，PCB 定(ding)制(zhi)(zhi)需(xu)在結(jie)(jie)構設計與(yu)(yu)工藝(yi)創(chuang)新上不斷(duan)突破。以(yi)智(zhi)能手(shou)機為例，其(qi)主板需(xu)集(ji)成處理器、內存、攝像頭模組(zu)等數(shu)十種元器件(jian)，PCB 定(ding)制(zhi)(zhi)通過(guo)采用(yong)高(gao)密度互(hu)聯（HDI）技術，增加線(xian)路(lu)(lu)(lu)層(ceng)數(shu)、縮小線(xian)寬線(xian)距(ju)，在有限空間內實現更(geng)多功能集(ji)成；同時(shi)，采用(yong)柔性 PCB（FPC）或軟(ruan)硬結(jie)(jie)合板，滿足(zu)手(shou)機折疊、彎曲的(de)(de)結(jie)(jie)構需(xu)求，提升產品(pin)設計靈(ling)活性。在可(ke)穿(chuan)戴(dai)設備領域(yu)，PCB 定(ding)制(zhi)(zhi)需(xu)兼顧小型(xing)化(hua)(hua)與(yu)(yu)低功耗，通過(guo)選用(yong)輕薄(bo)板材、優(you)化(hua)(hua)線(xian)路(lu)(lu)(lu)布局，打造適配手(shou)環、智(zhi)能手(shou)表(biao)的(de)(de)微型(xing)電(dian)路(lu)(lu)(lu)板，同時(shi)確保其(qi)在復雜穿(chuan)戴(dai)環境(jing)下(xia)的(de)(de)穩定(ding)性。此外(wai)，消(xiao)費(fei)電(dian)子(zi)對(dui)外(wai)觀(guan)要求較高(gao)，PCB 定(ding)制(zhi)(zhi)還(huan)可(ke)提供沉金、鍍鎳、OSP 等多種表(biao)面(mian)處理工藝(yi)，提升電(dian)路(lu)(lu)(lu)板的(de)(de)抗氧化(hua)(hua)性與(yu)(yu)美觀(guan)度。可(ke)以(yi)說，PCB 定(ding)制(zhi)(zhi)的(de)(de)技術升級，直接推動了消(xiao)費(fei)電(dian)子(zi)產品(pin)的(de)(de)迭代創(chuang)新。富盛(sheng)電(dian)子(zi)年銷 PCB 20 萬片，合作 15 家智(zhi)能熱水器企業，用(yong)于防干燒(shao)電(dian)路(lu)(lu)(lu)；深(shen)圳雙面(mian)鎳鈀金PCB定(ding)做(zuo)

    PCB 的設(she)計需遵循電(dian)磁兼容(rong)（EMC）原(yuan)則，避(bi)免電(dian)路(lu)間干擾。布局(ju)時(shi)需將(jiang)數字電(dian)路(lu)與模擬電(dian)路(lu)分開(kai)，數字電(dian)路(lu)高頻噪聲(sheng)(sheng)大，模擬電(dian)路(lu)對噪聲(sheng)(sheng)敏(min)感，兩(liang)者間距應(ying)不(bu)小(xiao)于 2cm，必要時(shi)設(she)置接(jie)地(di)(di)(di)隔離(li)帶。電(dian)源與地(di)(di)(di)線(xian)布局(ju)尤為關(guan)鍵，需采用粗地(di)(di)(di)線(xian)和(he)寬電(dian)源走線(xian)，減少阻抗，高頻電(dian)路(lu)中(zhong)地(di)(di)(di)線(xian)應(ying)形(xing)成(cheng)閉合回路(lu)，構(gou)成(cheng) “接(jie)地(di)(di)(di)平面”，降低接(jie)地(di)(di)(di)電(dian)阻。元件擺放需按(an)信號流向排列，避(bi)免交(jiao)叉走線(xian)，敏(min)感元件如晶振、傳(chuan)感器(qi)應(ying)遠離(li)干擾源，其周圍(wei)盡量鋪設(she)接(jie)地(di)(di)(di)銅皮，引腳(jiao)走線(xian)需短而直，減少信號傳(chuan)輸損耗(hao)和(he)輻射干擾。十二層PCB線(xian)路(lu)富盛電(dian)子(zi) PCB 原(yuan)材料庫(ku)存周轉率提升 25%，供應(ying)鏈更高效；

    柔(rou)性 PCB（FPC）的(de)制(zhi)造工(gong)(gong)藝與(yu)(yu)剛性 PCB 有較大差異(yi)，其基材(cai)為(wei)聚酰亞胺薄膜(mo)(mo)，厚(hou)度通(tong)(tong)(tong)常為(wei) 25-50μm。FPC 的(de)銅(tong)(tong)(tong)(tong)箔(bo)多采用(yong)壓延銅(tong)(tong)(tong)(tong)，延展性好，耐彎(wan)折次數(shu)可達 10 萬(wan)次以上(shang)，而電解銅(tong)(tong)(tong)(tong)箔(bo)適(shi)用(yong)于(yu)非彎(wan)折區(qu)域。制(zhi)造時需(xu)先在 PI 薄膜(mo)(mo)上(shang)涂(tu)覆粘合(he)劑，再與(yu)(yu)銅(tong)(tong)(tong)(tong)箔(bo)壓合(he)，形成(cheng)覆銅(tong)(tong)(tong)(tong)板(ban)，之后進行(xing)蝕刻(ke)、鉆孔等工(gong)(gong)序。FPC 的(de)覆蓋膜(mo)(mo)是關鍵組(zu)件(jian)，由 PI 薄膜(mo)(mo)和粘合(he)劑組(zu)成(cheng)，覆蓋在電路表面起保護作用(yong)，需(xu)通(tong)(tong)(tong)過熱壓與(yu)(yu)基板(ban)粘合(he)，邊緣需(xu)與(yu)(yu)電路對(dui)齊，避免覆蓋焊盤。此(ci)外，FPC 常需(xu)安裝(zhuang)補強板(ban)，增強局部(bu)機械強度，便于(yu)元件(jian)焊接(jie)和連接(jie)器安裝(zhuang)，補強板(ban)材(cai)質多為(wei) FR-4 或(huo)不銹鋼，通(tong)(tong)(tong)過粘合(he)劑固(gu)定。

    在(zai)(zai)電(dian)子產品研(yan)(yan)發競速賽(sai)中，時(shi)間就是先機(ji)。深圳市富盛電(dian)子精(jing)密(mi)技術(shu)有限公司(si)以 “多層板(ban) 24H 加急(ji)打樣(yang)” 的(de)能力，讓(rang)研(yan)(yan)發周期不再卡脖子。從(cong)(cong)四(si)層到十二層的(de)高(gao)難度 PCB 板(ban)，從(cong)(cong)高(gao) TG 材料到高(gao)頻高(gao)速板(ban)的(de)特殊工藝(yi)，富盛電(dian)子的(de)全(quan)自動化生產線如精(jing)密(mi)鐘表(biao)般運轉。激光鐳射鉆孔(kong)機(ji)確(que)保孔(kong)徑(jing)準(zhun)確(que)，LDI 曝光機(ji)讓(rang)線路精(jing)度達微(wei)米級，配(pei)合(he)進口 AOI 檢測設(she)備(bei)，實現 99.9% 的(de)交貨率。更關鍵(jian)的(de)是，從(cong)(cong)設(she)計溝(gou)通到樣(yang)品交付的(de)全(quan)流程可視化，讓(rang)客戶實時(shi)掌(zhang)握進度，實現 “現在(zai)(zai)設(she)計，明天測試” 的(de)研(yan)(yan)發加速度。富盛電(dian)子 PCB 定制，性價比(bi)出眾，為您節(jie)省成本開支。

    PCB（印(yin)制(zhi)(zhi)電(dian)路(lu)板(ban)(ban)(ban)）是電(dian)子(zi)(zi)設(she)備的主要載體(ti)，按層(ceng)數(shu)可分(fen)(fen)為單面(mian)(mian)板(ban)(ban)(ban)、雙(shuang)面(mian)(mian)板(ban)(ban)(ban)和(he)多層(ceng)板(ban)(ban)(ban)。單面(mian)(mian)板(ban)(ban)(ban)只(zhi)在基材(cai)一面(mian)(mian)覆銅，布(bu)線(xian)(xian)簡(jian)單，成(cheng)本低，適(shi)用于簡(jian)易電(dian)路(lu)如(ru)收(shou)音機、計算(suan)器等(deng)，其銅箔(bo)圖形需(xu)通(tong)(tong)(tong)過絲網印(yin)刷(shua)蝕(shi)刻制(zhi)(zhi)成(cheng)，導線(xian)(xian)與焊(han)盤的連(lian)接(jie)(jie)直(zhi)接(jie)(jie)可見。雙(shuang)面(mian)(mian)板(ban)(ban)(ban)兩面(mian)(mian)均有銅箔(bo)，需(xu)通(tong)(tong)(tong)過過孔(kong)(kong)實(shi)現上(shang)下層(ceng)電(dian)路(lu)導通(tong)(tong)(tong)，過孔(kong)(kong)分(fen)(fen)為通(tong)(tong)(tong)孔(kong)(kong)和(he)盲(mang)孔(kong)(kong)，通(tong)(tong)(tong)孔(kong)(kong)貫穿整(zheng)個基板(ban)(ban)(ban)，盲(mang)孔(kong)(kong)只(zhi)連(lian)接(jie)(jie)部分(fen)(fen)層(ceng)，適(shi)用于稍復雜的電(dian)路(lu)如(ru)小型電(dian)源適(shi)配器。多層(ceng)板(ban)(ban)(ban)則(ze)由三(san)層(ceng)及以上(shang)導電(dian)層(ceng)構成(cheng)，層(ceng)間通(tong)(tong)(tong)過絕緣層(ceng)粘合，可實(shi)現高密(mi)度(du)布(bu)線(xian)(xian)，常用于智(zhi)能手機、電(dian)腦(nao)等(deng)精(jing)密(mi)電(dian)子(zi)(zi)設(she)備，層(ceng)數(shu)從(cong) 4 層(ceng)到幾十(shi)層(ceng)不等(deng)，層(ceng)數(shu)越多，設(she)計和(he)制(zhi)(zhi)造難度(du)越大。信(xin)賴富盛電(dian)子(zi)(zi)，PCB 定制(zhi)(zhi)精(jing)度(du)高，性能表現更出色。十(shi)二層(ceng)PCB線(xian)(xian)路(lu)

富盛電子 PCB 在新能源設備領域的訂單量同(tong)比增長 30%。深(shen)圳(zhen)雙面鎳(nie)鈀金PCB定(ding)做

    PCB 的表(biao)面(mian)處理(li)工藝(yi)多樣，噴錫(xi)(xi)是較常(chang)用的一(yi)種，分為熱風整(zheng)(zheng)(zheng)平(ping)（HASL）和無(wu)鉛(qian)噴錫(xi)(xi)。熱風整(zheng)(zheng)(zheng)平(ping)通(tong)過(guo)將 PCB 浸入熔(rong)融錫(xi)(xi)鉛(qian)合金（或無(wu)鉛(qian)錫(xi)(xi)合金），再用熱風吹平(ping)表(biao)面(mian)，形(xing)成均(jun)勻的錫(xi)(xi)層，錫(xi)(xi)層厚(hou)度(du)約(yue) 5-20μm，焊接性(xing)(xing)好，成本(ben)(ben)低(di)，但表(biao)面(mian)平(ping)整(zheng)(zheng)(zheng)度(du)一(yi)般，不(bu)適(shi)合細間(jian)距元件。沉金工藝(yi)則是通(tong)過(guo)化學沉積(ji)在銅箔(bo)表(biao)面(mian)形(xing)成金層，金層厚(hou)度(du)薄(bo)（0.05-0.2μm），表(biao)面(mian)平(ping)整(zheng)(zheng)(zheng)，抗氧化性(xing)(xing)強，適(shi)用于 BGA、QFP 等細間(jian)距元件，不(bu)過(guo)成本(ben)(ben)較高。OSP（有(you)機 solderability preservative）處理(li)是在銅表(biao)面(mian)形(xing)成有(you)機保護(hu)膜，工藝(yi)簡單、成本(ben)(ben)低(di)，環(huan)保性(xing)(xing)好，但保護(hu)膜易受高溫(wen)影(ying)響，需控制焊接溫(wen)度(du)和時間(jian)。深(shen)圳雙面(mian)鎳鈀金PCB定做